Overview
- Industry reports say Samsung will ramp HBM4 in February 2026, with most output slated for Nvidia’s next accelerator platform and some volume for Google’s next‑gen TPU.
- SK Hynix is reported to deliver final 12‑layer HBM4 samples to Nvidia in early January, targeting formal volume production between February and March if validation completes on schedule.
- Suppliers including Samsung and SK Hynix have raised 2026 HBM3E pricing by nearly 20%, an unusual move before a new generation takes over, reflecting sustained orders from AI chip buyers.
- Procurement stress is escalating, with Korean media cited in Wccftech reporting a Google purchasing executive was fired after failing to secure long‑term HBM supply.
- ASUS formally denied plans to build a DRAM wafer fab, saying it will rely on supplier partnerships and product adjustments rather than invest in memory manufacturing.