Overview
- Xiaomi announced the Xuanjie O3, O100 and D100 on Monday, with the company saying O3 has entered scale production and will debut on the Xiaomi 18 Fold in September while O100 and D100 have finished development and are planned for commercial use in 2027.
- The O3 is billed as an 'AI flagship SoC' with a 10-core all-big CPU, a 16-core G2‑Ultra NX GPU and a 200 TOPS low-power NPU, and Xiaomi cited an AnTuTu score above five million for the chip.
- The O100 targets high‑bandwidth edge AI using a 6nm 3D wafer‑stack package with 28,672 data lines and up to 1.22TB/s near‑memory bandwidth to accelerate large models on devices.
- The D100 is positioned for intelligent driving, built on a 3nm process with a 20‑core CPU, 16‑core NPU and support for up to 160GB of memory, with Xiaomi saying it will pursue automotive validation ahead of 2027 commercial deployment.
- Xiaomi demonstrated prototypes including an O100 demo terminal and an AI Cube mini workstation that run on-device large models (Xiaomi cited 295 tokens per second for one demo) and said it has invested heavily in chips with more than 21 billion yuan spent and a roughly 3,000‑person chip team to build the broader supply and software ecosystem.