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Ren Zhengfei Says Huawei Can Match U.S. Chip Performance Despite Export Curbs

He told People’s Daily chip-stacking techniques using open-source platforms can close a generation gap through heavy research spending.

A view shows a Huawei logo at Huawei Technologies France headquarters in Boulogne-Billancourt near Paris, France, January 9, 2025. REUTERS/Gonzalo Fuentes/File Photo
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Overview

  • Ren Zhengfei acknowledged Huawei’s chips remain one generation behind U.S. counterparts but said performance gaps can be bridged with chip-stacking, cluster computing and non-Moore’s law methods.
  • He said Huawei invests about 180 billion yuan annually in research, allocating roughly one-third to theoretical studies aimed at driving semiconductor breakthroughs.
  • Ren’s comments ran on the front page of People’s Daily as U.S. Commerce Secretary Howard Lutnick and Chinese officials resumed London talks focusing on export restrictions.
  • The U.S. Department of Commerce issued guidance warning that any global use of Huawei’s Ascend AI chips could violate export controls.
  • Chinese firms are increasingly adopting open-source chip designs like RISC-V and exploring compound chip approaches to lessen reliance on U.S. technology.