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Rapidus Begins Test Production of 2nm Chips, Marking Key Milestone in Japan's Semiconductor Push

The state-backed chipmaker aims to release its first test wafers by July 2025 and achieve mass production by 2027, despite facing significant technological challenges.

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Rapidus

Overview

  • Rapidus officially started test production of 2-nanometer chips at its Hokkaido facility on April 1, 2025, using ASML's advanced EUV lithography systems.
  • The company plans to release its first batch of test wafers by July 2025 and provide process design kits (PDKs) to early customers for prototyping.
  • A new R&D center, Rapidus Chiplet Solutions (RCS), is being established to focus on advanced packaging and post-fabrication processes to enhance manufacturing capabilities.
  • Japan's government has allocated $11.5 billion to support Rapidus, part of a broader strategy to reduce reliance on foreign semiconductor technology.
  • Analysts remain skeptical about the feasibility of achieving mass production by 2027, citing the complexity of mastering cutting-edge tools and the company's inexperience.