Qualcomm Snapdragon X2 Rumored to Feature 18 Cores and Integrated Memory

Leaked details suggest Qualcomm's upcoming processor aims to challenge Intel, AMD, and Apple with high performance and innovative design.

The Snapdragon X2 is reportedly set to include up to 18 Oryon V3 cores, a 50% increase over its predecessor.
Leaked documents indicate a System-in-Package (SiP) design, integrating up to 48GB RAM and 1TB SSD for improved performance and efficiency.
Qualcomm is testing the chip with a liquid cooling system, hinting at its potential use in desktops and high-performance laptops.
The Snapdragon X2 is expected to target the high-end market under the 'Snapdragon X2 Ultra Premium' branding.
Speculation suggests more details may emerge during the Mobile World Congress (MWC), starting today in Barcelona.