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Qualcomm, MediaTek Reported to Target TSMC’s N2P 2nm Node in 2026 Race With Apple

Tight 2nm capacity may give Apple’s early allocation outsized leverage over who reaches N2P first.

Overview

  • Commercial Times reports that Qualcomm and MediaTek plan to use TSMC’s refined N2P process for the Snapdragon 8 Elite Gen 6 and Dimensity 9600.
  • TSMC has confirmed the first 2nm tape-out with a late‑2026 launch timeline, while industry reports place N2P mass production in the second half of 2026.
  • MediaTek is reported to have completed a 2nm tape-out and is targeting a late‑2026 debut for its first N2-class chipset.
  • Analysts expect initial 2nm capacity to be scarce at roughly 15,000–20,000 wafers per month, increasing competition for allocation.
  • Previous reports say Apple secured more than half of early 2nm supply, and a tipster disputes the N2P focus, underscoring that vendor plans remain unconfirmed.