Overview

• Qualcomm confirmed to ComputerBase that Snapdragon X2 Elite Extreme combines TSMC N3P and higher‑voltage N3X process variants via FinFlex to balance peak performance and efficiency.
• A Wccftech report citing analysis by Ian Cutress says X2 Elite Extreme uses a SiP memory design delivering 228 GB/s bandwidth, about 50% higher than the standard X2 Elite’s 152 GB/s, with packaging images indicating Samsung memory.
• For PCs, Qualcomm claims X2 Elite Extreme’s Oryon CPU is up to 75% faster than competitors at the same power, its GPU delivers 2.3× better performance per watt than the prior generation, and its Hexagon NPU reaches 80 TOPS.
• For phones, Snapdragon 8 Elite Gen 5 introduces agent‑style on‑device AI with data kept local and posts uplifts of up to 20% for its Oryon CPU, 23% for Adreno GPU in graphics‑heavy games, and 37% for the Hexagon NPU, plus first‑in‑class APV video recording.
• Qualcomm says flagship phones from brands including Samsung, Xiaomi, OnePlus, Honor and others will ship with Snapdragon 8 Elite soon, while X2 Elite‑based Windows devices are slated for H1 2026, and Oryon cores are planned to extend to lower‑tier lines.