Overview
- Playground Global and Celesta Capital led the $25 million Series A, bringing total funding to $31 million.
- Former Intel CEO Pat Gelsinger joined the board and says the first batch of chiplets is being produced by TSMC.
- An unnamed manufacturing partner is testing functionality, with broader customer trials planned for the first half of 2026.
- Engineering samples are available to potential customers, and the company says large tech firms could begin using the tech by late 2026.
- PowerLattice’s approach places a tiny power-delivery chiplet next to the processor to reduce energy loss, with reported savings of about 50% pending independent validation.