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3mo ago

Pentagon Awards $16 Million to BAE to Rebuild 45nm Radiation‑Hardened Chip Capability

Defense officials say the funding will secure supply lines for missile and space systems by restoring a domestic hub for trusted 45nm radiation‑hardened microelectronics.

BAE Systems’ radiation-hardened (rad-hard) application specific integrated circuits (ASICs) offer space missions advanced high density system-on-a-chip capabilities with optimized power and performance. Image: BAE Systems

Overview

  • The Department of Defense used Defense Production Act Title III funds to award BAE Systems $16 million to expand domestic processing and production of radiation‑hardened microelectronics.
  • The project is intended to reestablish BAE’s RH45 Storefront, a Radiation Hardened by Design 45nm offering that will provide standard processing products and resources for custom chip development.
  • DOD officials, including the assistant secretary for industrial base policy, said radiation‑hardened chips are critical inputs for missile, space, and other strategic systems and must be available domestically.
  • The award comes from the WIRE directorate’s DPA Title III investments and is the latest of five Title III grants that together total $102.6 million since the start of fiscal year 2026.
  • Restoring the RH45 capability aims to avoid costly program redesigns, shorten procurement risk for defense programs, and create a self‑sustaining domestic hub that suppliers and program offices can use.