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Odisha Breaks Ground on India’s First End-to-End Silicon Carbide Chip Plant

Backed by the India Semiconductor Mission, the ₹2,067 crore Bhubaneswar project aims to cut import reliance for high‑voltage electronics.

Overview

  • Chief Minister Mohan Charan Majhi laid the foundation at Infovalley, Jatni, with Union IT Minister Ashwini Vaishnaw joining by video as SiCSem, a subsidiary of Archean, kicked off construction.
  • The integrated facility is designed to process 60,000 SiC wafers a year with packaging capacity of about 96 million units.
  • SiCSem targets bringing the plant online in the 2027–28 timeframe.
  • Employment projections vary, with over 1,000 direct jobs expected and total opportunities estimated at roughly 5,000.
  • An industry–academia push includes a ₹64 crore Research & Innovation Centre at IIT Bhubaneswar and ₹5 crore MPLAD support for a NaMo Semiconductor Lab, with the company also citing collaboration with UK-based Clas‑SiC Wafer Fab.