Nvidia Urges SK hynix to Accelerate HBM4 Chip Production

SK hynix is responding to Nvidia's request to advance the delivery of next-generation HBM4 chips by six months to meet rising AI demands.

Nvidia CEO Jensen Huang requested SK hynix to expedite the release of 12-layer HBM4 chips, originally planned for the first half of 2026, to the end of 2025.
SK hynix, a leader in the HBM market, is ramping up production of its 12-layer HBM3E chips, with 16-layer samples expected in early 2025.
The upcoming HBM4 will feature 24Gb and 32Gb memory layers, with stacking options up to 16-high, enhancing performance for AI and HPC applications.
SK hynix is also advancing its technology with the development of PCIe 6.0 SSDs, UFS 5.0 storage, and new memory solutions like Processing Near Memory.
The collaboration between SK hynix and TSMC will utilize advanced process technologies to integrate memory directly into CPUs and GPUs.