Nvidia Shifts to Advanced CoWoS-L Packaging for Blackwell AI Chips

The transition addresses capacity constraints and evolving performance needs while maintaining robust demand for TSMC's advanced packaging technologies.

• Nvidia is transitioning from CoWoS-S to CoWoS-L packaging for its next-generation Blackwell AI chips to meet increased performance demands and interconnect bandwidth requirements.
• Despite this shift, Nvidia's overall demand for Taiwan Semiconductor Manufacturing Co.'s (TSMC) advanced packaging remains strong, with plans to ramp up CoWoS-L capacity.
• TSMC is expected to double its CoWoS production capacity by 2025, with Nvidia projected to utilize over 50% of this expanded capacity.
• Packaging capacity constraints have been a bottleneck for Blackwell chips, prompting Nvidia to explore additional technologies like Fan-Out Panel Level Packaging (FOPLP) for certain products.
• Rumors suggest Nvidia may also develop a monolithic B200A GPU using CoWoS-S technology, though this remains speculative and unconfirmed by the company.

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