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NVIDIA Says Rubin Is in Fab, Eyes H2 2026 Volume as Blackwell Ultra Hits Full Ramp

The company describes Rubin as a third-generation NVLink rack-scale system with a mature supply chain, with current GB300 capacity at roughly 1,000 racks per week.

Overview

  • CEO Jensen Huang confirmed the six-chip Rubin platform is in fabrication at TSMC and is targeted for volume production in the second half of 2026 as part of NVIDIA’s annual cadence.
  • Rubin’s stack comprises the Rubin GPU, Vera CPU, CX9 SuperNIC, an NVLink 144 scale-up switch, a Spectrum‑X scale-out/scale-across switch, and a silicon photonics processor.
  • Blackwell Ultra (GB300) is in full production with demand described as extraordinary, and factories are producing approximately 1,000 racks per week with capacity set to accelerate.
  • NVIDIA reported that the Blackwell Ultra platform generated tens of billions of dollars in revenue this quarter, while gaming revenue reached a record $4.3 billion on strong Blackwell GeForce sales.
  • Management projects Blackwell, Rubin, and follow-on platforms could scale into a $3 trillion to $4 trillion AI infrastructure opportunity over the coming years.