NVIDIA Envisions Future AI Chips with 3D GPU Stacking and Silicon Photonics

At IEDM 2024, NVIDIA outlined a speculative roadmap for AI accelerators featuring vertical GPU tiers, stacked DRAM, and light-based data transmission.

• NVIDIA's concept includes vertically stacked GPU tiles, referred to as 'GPU tiers,' to increase chip density and reduce interconnect latency.
• The design integrates silicon photonics, a light-based technology for faster and more energy-efficient data transmission, though it is still in early development stages.
• The proposed chips also feature 3D-stacked DRAM with six chips per GPU tile, enhancing memory density and performance.
• Challenges such as thermal management and the immaturity of silicon photonics technology suggest this innovation is unlikely to materialize before 2028-2030.
• While primarily aimed at AI computing, some of these technologies could eventually influence consumer GPUs, though not in the immediate future.

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