Overview
- Amkor and NVIDIA announced a multi-year partnership to expand advanced semiconductor packaging capacity in the United States, with a planned facility expansion in Arizona.
- NVIDIA will provide a prepayment to underwrite the Arizona expansion and the companies will coordinate long-term technology roadmaps around high-density interconnects and heterogeneous integration.
- The agreement builds on Amkor’s existing role packaging NVIDIA products and aims to scale packaging and test capabilities that move memory and processors closer together for faster, more power-efficient AI systems.
- Markets reacted strongly: Amkor shares climbed about 15.7% in after-hours trading on the announcement, while the companies did not disclose the dollar value, construction timeline, or specific capacity increases.
- Advanced packaging is an increasingly critical layer of chip performance because it links different silicon components in one package, and the deal is presented as a step toward more geographically diverse and resilient U.S. supply chains for AI infrastructure.