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Nintendo Switch 2 Teardown Confirms Key Hardware Specs and Performance Details

Independent analysis of a leaked motherboard reveals the Switch 2's custom NVIDIA T239 SoC, Ampere-based GPU, and CPU configuration, highlighting performance potential ahead of its June 5 release.

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Die shot of T239 chip from Geekerwan video on the Switch 2 processor

Overview

  • Teardown analysis of a leaked Switch 2 unit confirms the use of NVIDIA's custom T239 SoC with a die size of 207 mm², nearly double that of the original Tegra X1.
  • The GPU features an Ampere-based design with 1,536 CUDA cores, delivering performance on par with the Steam Deck in handheld mode and a 53% boost in docked mode.
  • The SoC integrates eight Arm Cortex-A78C CPU cores, which underperform compared to the Steam Deck, trailing by 140% in single-core and 52% in multi-core Geekbench 6 benchmarks.
  • Fabricated using a hybrid Samsung 10/8 nm process, the chip's 2021 tapeout date suggests the hardware was finalized years before release, aligning with earlier delays.
  • Simulated tests indicate potential for solid gaming performance, though full optimization, including DLSS and AI upscaling, will be critical to meet expectations.