Overview
- Micron is reported to build a high-bandwidth memory facility inside its Hiroshima compound to serve AI applications.
- Japan’s METI would subsidize up to ¥500 billion of the project’s cost, according to the Nikkei report.
- Construction is targeted to begin in May 2026 with initial HBM shipments around 2028, the outlets reported.
- Reuters said it could not immediately verify the report, and Micron has not publicly confirmed the investment.
- Tokyo has earmarked roughly ¥5.7 trillion since 2021 for semiconductors and approved an extra ¥252.5 billion, with prior aid to Micron, TSMC and Rapidus as it seeks to diversify production away from Taiwan and challenge SK Hynix and Samsung.