New Die Shots Reveal Key Differences Between Apple's A18 and A18 Pro Chips

Close-up analyses show distinct designs and configurations for the A18 and A18 Pro, debunking earlier assumptions of chip binning.

The A18 Pro features a 105mm² die size, larger than the A18's 90mm², allowing for a bigger SLC cache and an extra GPU core.
Both chips utilize TSMC's InFO-POP packaging, enhancing thermal and electrical performance by stacking DRAM directly on the chip die.
Despite sharing a 6-core CPU and a 16-core Neural Engine, the A18 and A18 Pro are confirmed to be entirely different chips.
The A18 Pro supports additional features like USB 3 and ProMotion display technology, which are absent in the standard A18.
New analyses suggest potential applications for the A18 chip in future Apple products, including the iPad mini 7 and iPhone SE 4.