Particle.news

Download on the App Store

Modi Pledges Made-in-India Chips by Year-End Following Approval of Four New Semiconductor Projects

Industry officials say the first marketed chips this year will be packaged devices from OSAT units rather than wafers from new silicon fabs

Image
Prime Minister Narendra Modi salutes during address to the nation from the ramparts of Red Fort on 79th Independence Day. (ANI)
Image
Image

Overview

  • The Union Cabinet sanctioned four additional projects under the India Semiconductor Mission, bringing the total to ten units valued at about ₹1.6 lakh crore spread across six states
  • New approvals include India’s first commercial silicon-carbide fabrication plant in Bhubaneswar and an advanced 3D glass substrate packaging unit for high-end chip assembly
  • Officials clarify that the initial “Made-in-India” chips expected by year-end will emerge from assembly, testing and packaging facilities instead of newly built large-scale silicon fabs
  • The government’s phased approach prioritizes mature-node (28–65 nm) and SiC production to meet demand in automotive, telecom and power sectors before pursuing advanced-node capacity
  • Political leaders from Congress and the BJP have traded barbs over historical credit, with Congress citing the 1983 Mohali SCL operations and BJP ministers blaming past policy paralysis for missed investments