Overview

• Microsoft reports lab results showing up to a 65% reduction in peak silicon temperature rise and as much as threefold improvement versus advanced cold plates, depending on workload and configuration.
• Coolant flows through micro‑channels etched on the back of the chip to target hotspots closer to the heat source than conventional cold plates.
• Designs were shaped using AI and bio‑inspired geometries that resemble leaf veins, developed in partnership with Swiss startup Corintis.
• Demonstrations included lab tests and a server running simulated Teams workloads, though the company has not disclosed details about the coolant used.
• Engineers highlight the need for leak‑proof packaging and chip‑fab integration before wider use, with potential benefits including denser racks, safer overclocking, 3D chip architectures, and lower datacenter energy costs.