Overview

• The design moves coolant through thread-like channels etched on the chip’s backside, using AI to target hot spots with leaf-like, bio-inspired flow patterns.
• Microsoft claims up to three times better cooling than cold plates and about a 65 percent drop in maximum GPU silicon temperature rise, depending on workload and chip type.
• Demonstrated on a server running simulated Teams meetings, the approach is pitched to enable overclocking, denser rack layouts that can reduce latency, and higher-quality waste-heat reuse.
• The company emphasizes performance and efficiency in its messaging, with environmental benefits referenced only briefly as sustainability and reduced grid stress.
• The work remains a prototype requiring reliability testing, manufacturing integration, scaling plans, and independent verification before any broad deployment.