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4w ago

Micron Raises U.S. Investment to More Than $250 Billion as Clay Megafab Goes Vertical

The company is locking long‑term wafer supply and customer deals to secure capacity for surging AI memory demand and to expand domestic production.

Micron aims to produce 40% of its DRAM in the U.S.
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Overview

  • Micron said Thursday it will increase planned U.S. manufacturing and R&D spending to more than $250 billion through 2035 and marked the first concrete pour at its Clay, New York megafab, beginning vertical construction.
  • The company pledged up to $3 billion to strengthen U.S. suppliers, including a $500 million position and a 10‑year wafer supply agreement with GlobalWafers for the Sherman, Texas 300 mm plant.
  • Micron has signed about 16 multi‑year strategic customer agreements that stretch into 2030 to lock committed demand while pricing and allocations for high‑bandwidth memory remain tight.
  • New fab timelines keep a near‑term supply gap: Micron expects first wafer output from its first new Idaho fab in mid‑2027, a second Idaho fab in late‑2028, and Clay production around 2030, so added U.S. capacity will lag current AI demand.
  • The push raises political and legal pressure because three firms control most DRAM and HBM capacity, which has driven record margins and prompted a U.S. class‑action complaint and increased regulatory scrutiny.