Micron Invests $7 Billion in Singapore for Advanced AI Chip Facility

The new high-bandwidth memory packaging plant will expand Micron's manufacturing capacity, creating thousands of jobs and supporting the growing AI industry.

Micron Technology broke ground on Singapore's first high-bandwidth memory (HBM) advanced packaging facility, a $7 billion investment aimed at meeting rising AI-driven demand for memory chips.
The facility, located near Micron's existing operations in Singapore, is expected to begin operations in 2026, with significant capacity expansion planned by 2027.
The project will create 1,400 jobs initially, with plans to add up to 3,000 roles in areas such as packaging development, assembly, and testing over the coming years.
HBM technology, critical for AI applications like generative AI and GPUs, is projected to see rapid market growth, from $4 billion in 2023 to over $100 billion by 2030.
Micron's Singapore facility will strengthen the city-state's role in global semiconductor supply chains, complementing the company's existing operations in the U.S., Japan, and Taiwan.