MediaTek Unveils Powerful New Chipsets for Smartphones and Foldables

The Dimensity 7300 series and upcoming Dimensity 9400 promise significant performance and efficiency improvements.

The Dimensity 7300 and 7300X bring AI capabilities to midrange and foldable phones, offering better performance and energy efficiency.
The Dimensity 7300 series supports advanced camera features, including 200-megapixel sensors and 4K HDR video recording.
MediaTek's Dimensity 9400 is set to challenge Qualcomm's dominance with impressive benchmark scores and lower power consumption.
The Dimensity 9400 uses TSMC’s 3nm N3E node technology, enhancing performance and efficiency significantly.
A premium Android phone featuring the Dimensity 9400 will launch in the U.S. market later this year.