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MediaTek Unveils 3nm Dimensity 9500s and 4nm 8500 to Challenge Qualcomm

MediaTek positions the parts against Qualcomm to push flagship features into more phones.

Overview

  • The Dimensity 9500s uses TSMC’s 3nm N3E process with an all‑big‑core CPU layout: one Cortex‑X925 up to 3.73GHz, three Cortex‑X4, and four Cortex‑A720, backed by 19MB of CPU cache, LPDDR5X 9600MT/s memory support, and UFS 4.0 storage.
  • Graphics are handled by an Arm Immortalis‑G925 GPU with hardware ray tracing, while MAGT 3.0 and MRFC 3.0 target up to 165fps in supported games with a power‑optimized 120fps mode.
  • AI and imaging features include a flagship NPU for generative models, tools like AI photo editing and document summarization, support for up to a 320MP sensor, 18‑bit RAW, and 8K Dolby Vision video capture.
  • Connectivity on the 9500s includes an integrated 5G Release‑17 modem with up to 7Gbps downlink, Wi‑Fi 7 up to 6.5Gbps, and claimed Bluetooth phone‑to‑phone range of up to 5 kilometers.
  • The 4nm Dimensity 8500 targets the premium mid‑range with eight Cortex‑A725 cores up to 3.4GHz, a Mali‑G720 GPU touting 25% higher performance and 20% lower power than its predecessor, LPDDR5X support, Wi‑Fi 6E, and an 8th‑gen NPU, with devices expected later in 2026 pending independent tests.