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MediaTek Tapes Out Flagship SoC on TSMC’s 2nm Node

TSMC’s nanosheet-based 2nm delivers full-node improvements versus N3E.

Overview

  • MediaTek said the unnamed flagship chip has completed tape-out and is slated to reach the market by the end of 2026.
  • TSMC’s 2nm enters mass production in the second half of 2025, with about 1.2× higher logic density, up to 18% higher performance at the same power, or roughly 36% lower power at the same speed compared with N3E.
  • The companies highlighted a long-running partnership across mobile, computing, automotive and data center platforms, with MediaTek executives emphasizing efficiency gains for flagship products.
  • MediaTek did not disclose the product name or target segment; reports suggest it could be a Dimensity 9600-class chip, which remains unconfirmed.
  • MediaTek joins early N2 adopters as industry watchers expect other major clients such as Apple, Nvidia and AMD to roll out 2nm-based products.