MediaTek Dimensity 9400+ Launches with Improved AI and Efficiency

Built on TSMC's 3nm N3E process, the chipset offers incremental upgrades in AI, connectivity, and power efficiency, with initial rollouts in China via Oppo devices.

MediaTek has officially launched the Dimensity 9400+, an upgraded version of its flagship chipset, featuring modest improvements over its predecessor.
The chipset is built using TSMC’s advanced 3nm N3E process, enhancing power efficiency and enabling an all performance cores configuration.
Key upgrades include a 20% boost in agentic AI performance through the MediaTek NPU 890 with Speculative Decoding+ and improved generative AI capabilities.
The Dimensity 9400+ supports advanced multimedia features like a 12-core Arm Immortalis GPU with ray tracing, LPDDR5X RAM, UFS 4.0 storage, and up to 320MP camera support with 8K 60FPS video capture.
Initial devices powered by the Dimensity 9400+, including Oppo's Find X8s series, have launched in China, with global availability expected soon.