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MediaTek Debuts 3nm Dimensity 9500 to Power Android Flagships

First phones using the platform are expected in the fourth quarter.

Overview

  • MediaTek’s third‑generation all‑big‑core design pairs a 4.21GHz ultra core with three premium and four performance cores, with company claims of up to 29–32% higher single‑core and 16–17% higher multi‑core performance and up to 55% lower peak power versus the prior chip.
  • The integrated NPU 990 with Generative AI Engine 2.0 is touted to double AI compute, enable 4K on‑device image generation, handle 128K‑token text, and support low‑bit processing to cut power use for always‑on small models.
  • An Arm G1‑Ultra GPU is claimed to deliver up to 33% higher peak graphics performance, 42% better power efficiency, hardware‑accelerated ray tracing, and frame‑rate interpolation to 120FPS, with support highlighted for Unreal Engine features.
  • Four‑lane UFS 4.1 storage support is billed to double read/write speeds and speed large AI model loading by about 40%, complementing new cache and memory architecture changes.
  • The SoC is manufactured on TSMC’s 3nm process, and outlets report initial devices from partners such as Vivo and Oppo are planned for Q4 2025, with real‑world results to be validated in independent testing.