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Leaks Point to Apple A20 'Borneo' Chips on TSMC 2nm for iPhone 18 Pro and Foldable

Unconfirmed reports also flag sharply higher 2nm chip costs, raising questions about pricing for Apple’s 2026 lineup.

Overview

  • A Weibo tipster known as Mobile Phone Chip Expert is cited by multiple outlets as saying Apple’s A20 series carries the codenames Borneo (A20) and Borneo Ultra (A20 Pro).
  • Reporting maps the standard A20 to the base iPhone 18 and the A20 Pro to the iPhone 18 Pro and Pro Max as well as Apple’s first foldable iPhone.
  • Coverage says the A20 family will shift to TSMC’s 2nm N2 process, with reported targets of 10–15% higher performance or 25–30% lower power versus 3nm N3E.
  • China Times sourcing relayed by Tom’s Guide claims TSMC’s 2nm wafers will cost at least 50% more than 3nm, and separate leaks peg the foldable near $2,000.
  • Wccftech adds that Apple is expected to adopt WMCM packaging and has secured significant early N2 capacity, though neither Apple nor TSMC has confirmed these details.