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Leaked Qualcomm SM8845 Chip Brings Snapdragon 8 Elite Power to Sub-Flagship Tier

Featuring custom Oryon cores built on TSMC’s 3nm N3P process, the SM8845 is set to power devices from major Chinese brands when it debuts at Qualcomm’s late-September Summit.

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Overview

  • Leaked reports indicate that the SM8845, tentatively branded as Snapdragon 8s Elite or 8 Plus, will replace the Snapdragon 8s Gen 4 in a new sub-flagship tier.
  • It will integrate Qualcomm’s custom Oryon cores in an all-big core CPU setup to deliver performance on par with the existing Snapdragon 8 Elite.
  • Fabricated on TSMC’s 3nm N3P process and borrowing peripherals from the upcoming Snapdragon 8 Elite 2, the SM8845 aims for slight efficiency and performance gains.
  • Major Chinese OEMs including OPPO, vivo, HONOR, and OnePlus are reported to plan SM8845-powered devices, some advertised with batteries up to 8,000 mAh.
  • Qualcomm is expected to officially unveil the SM8845 alongside the Snapdragon 8 Elite 2 at its Snapdragon Summit in late September.