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Leaked Galaxy S26 Plans Point to Feb. 25 Unpacked, Slimmer Design and Snapdragon-Only Ultra

Fresh leaks emphasize a thinner build with a first built-in Qi2 magnet ring as key camera and chip choices remain in doubt.

Overview

  • Multiple reports point to a Feb. 25, 2026 Unpacked in San Francisco with retail availability reportedly slipping to early March and a three-model lineup expected.
  • A leaked diagram pegs the base Galaxy S26 at about 6.9mm thick, while recent images suggest more rounded edges, a flat display, and an enclosed camera module for the Ultra.
  • The same diagram hints at a built-in Qi2 magnetic ring for wireless charging, which would be the first time Samsung integrates Qi2 magnets into a Galaxy phone.
  • Chip allocation chatter signals Qualcomm powering most units, with one report claiming the S26 Ultra will use Snapdragon 8 Elite Gen 5 worldwide rather than Exynos.
  • Camera details remain disputed as leakers clash over the 3x telephoto sensor, even as other tips point to brighter lenses and a new APV video codec to bolster imaging performance.