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6h ago

Jensen Huang Presses TSMC to Double Capacity as Nvidia Flags Tight Memory Supply

Huang’s Taiwan visit underscores Nvidia’s push for greater wafer and memory supply to fuel AI buildouts.

Nvidia CEO Jensen Huang arrives at the company's year-end party in Taipei, Taiwan January 30, 2026. REUTERS/Ann Wang
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Visitors watch a wafer shown on screens at the TSMC Renovation Museum in Hsinchu. TSMC must increase output this year as Nvidia “needs a lot of wafers”, according to Jensen Huang. Photo: AFP

Overview

  • Speaking in Taipei after hosting a high-profile “trillion-dollar” dinner with partners, Huang said TSMC will likely need to boost capacity by more than 100% over the next decade.
  • Huang told reporters he needs “a lot of wafers” this year and praised TSMC’s execution while urging faster output to meet surging AI demand.
  • TSMC has guided capital spending as high as $56 billion this year, with further increases signaled for 2028 and 2029 to support long-term AI-driven growth.
  • Huang warned of a near-term crunch in advanced memory and said Nvidia is working with every major HBM supplier, including SK Hynix, Samsung and Micron.
  • He dismissed mainland China rumors that Nvidia’s H200 chips have regulatory clearance, saying no orders have been placed and final approval remains pending.