Overview
- The standard targets up to 10.8 GB/s peak bandwidth with 6,400 MB/s per lane, a substantial jump over UFS 4.x.
- JEDEC indicates backward compatibility with UFS 4.0 and 4.1 to ease platform integration.
- Design changes include a dedicated power rail, inline hashing, integrated link equalization, and improved noise isolation between the PHY and memory subsystem.
- The specification is aimed at smartphones and tablets and is also scoped for wearables, automotive, edge computing, and gaming consoles.
- Industry reporting expects finalization in 2026 with supplier sampling by late 2026 and first devices likely in late 2026 to early 2027, with Samsung seen as a probable early chip maker.