Overview
- Officials are finalizing a ministerial science and technology memorandum covering seven fields including AI, research security, beyond‑5G/6G, pharmaceuticals and biotechnology, quantum, nuclear fusion, and space for signature during the visit.
- A separate shipbuilding memorandum would create a Japan–U.S. working group, channel Japanese investment and design expertise into U.S. yards, expand workforce training, and include provision of icebreaker technology.
- Draft language for the tech pact underscores AI interoperability, cooperation on cutting‑edge semiconductors, and coordinated exports of AI infrastructure with China in mind.
- Reported signatories are Economic Security Minister Kimi Onoda and OSTP Director Michael Kratsios for the tech memorandum, with Transport Minister Yasushi Kaneko and U.S. Ambassador George Glass for shipbuilding.
- The shipbuilding effort links to July’s trade deal and a reported $550 billion Japanese investment pledge in U.S. industries, and officials are also discussing a minerals memorandum to diversify rare‑earth supply chains.