Intel Tests 18A Wafers at Arizona Fab, Achieving Key Milestone in U.S. Chip Manufacturing

The company's first run of 1.8nm-class wafers in Arizona signals progress for its advanced semiconductor technology and domestic production ambitions.

• Intel's Arizona Fab 52 and Fab 62 have completed initial testing of 18A (1.8nm-class) wafers, marking a significant development for the company's manufacturing capabilities.
• This milestone represents the transfer of Intel's advanced 18A process from its Oregon facility to its new high-volume production site in Arizona.
• The 18A node features cutting-edge RibbonFET transistors and backside power delivery, promising improved performance, reduced power consumption, and higher transistor density.
• The development coincides with Intel's appointment of new CEO Lip-Bu Tan, which contributed to a 15% rise in the company's stock price this week.
• While the Arizona fab remains in the testing phase, Intel plans to use the 18A process for upcoming products like Panther Lake processors, with mass production anticipated later this year.

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