Overview
- Taiwan-based DigiTimes reported that Nvidia is evaluating Intel Foundry for the Feynman GPU’s I/O die using 18A or potentially 14A, with Intel to handle about 25% of final packaging via EMIB.
- Coverage says TSMC would remain the primary manufacturer for Feynman’s core compute dies and roughly 75% of production and packaging, keeping the bulk of work at the Taiwanese giant.
- Intel, Nvidia, and Apple have not confirmed the report, and Intel declined to comment, leaving timing and scope—targeted for 2028—subject to significant uncertainty.
- Intel stock rose roughly 10–11% on Wednesday following the coverage, and a filing showed CFO David Zinsner bought nearly $250,000 of Intel shares this week.
- Reports cite U.S. policy pressures and tariff risks as drivers of a dual‑foundry approach, even as questions persist about Intel’s 14A commitment, capacity, and advanced packaging compatibility.