Overview

• Intel unveiled two new 18A process variants, 18A-P and 18A-PT, at the Direct Connect 2025 event, targeting broad applications and AI-optimized multi-die designs.
• High-volume production for the 18A node is confirmed to begin in the second half of 2025, with initial risk production already underway.
• Key ecosystem partnerships with Synopsys, Cadence, and Siemens EDA were announced, enabling certified design flows and early enablement for Intel's advanced nodes.
• Broadcom and Nvidia are among the customers planning test chips on Intel's 18A process, signaling early interest in the foundry's capabilities.
• Intel's roadmap emphasizes AI-optimized nodes and advanced packaging technologies, such as Foveros Direct and EMIB, to meet growing demand for AI and edge computing solutions.