Intel Assembles First High-NA EUV Tool, Pioneering Advanced Chipmaking

Intel's new High-NA EUV tool marks a significant advancement in semiconductor manufacturing, positioning the company to develop smaller, more efficient chips.

Intel completes assembly of the first commercial High-NA EUV chipmaking tool at its Oregon facility, setting the stage for its 14A process development targeted for 2025.
The High-NA EUV tool allows for up to 2.9X transistor density improvement, enabling Intel to print features significantly smaller than current capabilities.
ASML, the manufacturer of the High-NA tool, also benefits from the rising demand for advanced chipmaking equipment, driven by the global AI technology boom.
Intel plans to use the High-NA technology for at least three upcoming process nodes, highlighting its long-term strategic importance.
The installation and calibration of Intel's High-NA EUV tool will continue over the next six months, with significant milestones expected soon.