Particle.news
Download on the App Store

Intel Announces Additional 860 Million Ringgit Investment in Malaysia for Assembly and Testing

The move builds on Intel’s 2021 plan for a $7 billion advanced packaging facility in Penang.

Overview

  • Prime Minister Anwar Ibrahim said the new funding was confirmed after his meeting with Intel CEO Lip-Bu Tan.
  • The investment is reported as roughly $208 million using an exchange rate of $1 to 4.1300 ringgit cited by outlets.
  • The update reinforces Malaysia’s role in downstream chip manufacturing focused on assembly, testing and advanced packaging.
  • Coverage attributes the announcement to the prime minister’s social media post, with no operational timeline or job figures provided.
  • DigiTimes reported Intel’s Penang advanced packaging facility is 99% complete with a total investment of about 12 billion ringgit.