Overview

• Intel introduced two new 18A process variants: 18A-P optimized for mass-market applications and 18A-PT tailored for multi-die AI accelerators with TSV support.
• The 18A process remains on track for high-volume production in the second half of 2025, with several customers committed to building test chips.
• Intel is collaborating with EDA vendors Synopsys, Cadence, and Siemens to streamline chip design on 18A and 18A-P nodes, with certified tools and IP now available.
• The company also distributed early design kits for its 14A process, featuring PowerVia 2.0, which is slated for high-volume manufacturing in the second half of 2026.
• Intel announced a partnership with packaging provider Amkor to expand access to advanced packaging technologies for its customers.