Overview

• Minister of State Jitin Prasada told ANI the first packaged chip is slated to leave assembly lines by December 2025.
• The government counts 10 semiconductor projects under implementation with investments above Rs 1.60 lakh crore across Gujarat, Assam, Uttar Pradesh, Punjab, Odisha and Andhra Pradesh.
• Commercial output from these facilities is projected over a 1–5 year window, with more than 29,000 direct jobs expected depending on automation levels.
• Under the Semicon India programme, the Centre offers up to 50% fiscal support on a pari-passu basis for CMOS fabs, display fabs, compound semiconductors, sensors and ATMP/OSAT units.
• Ecosystem measures include a Rs 1,000 crore DLI scheme backing 72 design firms including 23 P‑DLI projects, new AICTE curricula for VLSI and IC manufacturing, and an IndiaAI Mission that precedes an AI Impact Summit in February 2026.