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Hyundai Mobis Sets 2027 Targets, Chip Scale-Up and New Tech Road Map at Investor Day

The supplier outlined a three‑pillar plan focused on technology competitiveness, profitability, a broader global customer base.

Hyundai Mobis Co.'s headquarters in Seoul (Yonhap)
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Overview

  • The company targets average annual sales growth of over 8 percent and a 5–6 percent operating margin by 2027, supported by a portfolio review of roughly 60 products to prioritize profitability.
  • Commercial deployment of its software‑defined vehicle platform is planned after 2028, and a holographic windshield co‑developed with Zeiss is slated for launch in 2029.
  • Hyundai Mobis reports 16 automotive chip types developed with about 20 million units to be produced this year, 11 next‑generation chips in development, a two‑track approach spanning system and power semiconductors, and a semiconductor‑ecosystem forum scheduled for next month.
  • The firm is entering robotics through actuators that leverage steering‑system expertise and intends to expand into sensors and controllers for humanoid robots.
  • Global core‑parts sales to non‑captive customers are targeted to reach 40 percent by 2033, and shareholder returns include 620 billion won of treasury shares repurchased and canceled this year.