Overview

• Hyundai Mobis guided to more than 8 percent annual sales growth and a 5–6 percent operating margin by 2027, coupled with portfolio restructuring to prioritize profitability.
• It outlined a three‑pillar push spanning electrification, software‑defined vehicles and expansion into automotive semiconductors and robotics, with a goal to lift global customer share in core parts to 40 percent by 2033.
• The semiconductor plan includes 16 chip types already developed, about 20 million units targeted for production this year, 11 next‑generation chips in R&D and a top ISO 26262 safety certification, alongside a two‑track focus on system and power semiconductors.
• Product timelines include a holographic windshield co‑developed with Zeiss targeted for 2029 and SDV platform deployment after 2028, with additional EV battery safety features such as heat‑blocking materials and automatic fire suppression highlighted.
• The company said it repurchased and canceled 620 billion won in treasury shares this year and reaffirmed a predictable shareholder‑return policy including dividends and buybacks.