Overview

• Huawei plans to start mass production of HBM2 memory by 2026, collaborating with local companies like Fujian Jinhua Integrated Circuit.
• The initiative is supported by the Chinese government and includes a consortium of Chinese semiconductor firms.
• HBM is crucial for AI processors, and local production aims to sidestep reliance on restricted US exports.
• The move could significantly improve the performance of Huawei's AI chips, such as the Ascend series, by ensuring a stable supply of high-performance memory.
• Challenges remain due to international regulations and potential US sanctions on partners like ChangXin Memory Technologies.