Huawei to Initiate In-House HBM Production by 2026 to Boost AI Capabilities in China

The tech giant partners with local firms to develop high bandwidth memory, aiming to overcome international tech limitations and enhance domestic AI technologies.

• Huawei plans to start mass production of HBM2 memory by 2026, collaborating with local companies like Fujian Jinhua Integrated Circuit.
• The initiative is supported by the Chinese government and includes a consortium of Chinese semiconductor firms.
• HBM is crucial for AI processors, and local production aims to sidestep reliance on restricted US exports.
• The move could significantly improve the performance of Huawei's AI chips, such as the Ascend series, by ensuring a stable supply of high-performance memory.
• Challenges remain due to international regulations and potential US sanctions on partners like ChangXin Memory Technologies.

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