Engineers Develop Memory Device That Operates Beyond 1,100°F

The new technology could enable computers to function in extreme heat environments, including jet engines and planetary exploration.

Researchers at the University of Michigan, in collaboration with Sandia National Laboratory, have created a memory device capable of operating at temperatures over 1,100°F (600°C).
The device uses tantalum oxide and a solid electrolyte to store data through an electrochemical process, similar to how a battery functions.
Unlike conventional silicon-based memory, which fails at high temperatures, this device remains stable by moving oxygen ions instead of electrons.
While the device can store data reliably for over 24 hours at extreme temperatures, it requires a minimum of 500°F (250°C) to write new information, a limitation researchers suggest could be addressed with built-in heaters.
The technology has potential applications in environments like aerospace engines, geothermal wells, and Venus exploration, with additional benefits for energy-efficient AI computing in extreme conditions.