Particle.news

Eliyan Raises $145 Million to Scale Electro‑Optical Chiplet Interconnects

The funding will accelerate commercialization of Eliyan’s electro‑optical chiplet technology to ease bandwidth limits that keep AI processors idle.

Syrus Ziai, Ramin Farjadrad and Patrick Soheili, co-founders of Eliyan, a Santa Clara, California-based startup, pose for a picture in Santa Clara, California, U.S., in this handout photo obtained by Reuters on July 28, 2026. Eliyan Corporation/Handout via REUTERS

Overview

  • Eliyan announced a $145 million Series C at a $1 billion valuation, a deal disclosed Wednesday and led by Seligman Ventures with participation from Cisco Investments and Lumentum.
  • Seligman managing partner Umesh Padval will join Eliyan’s board as part of the financing, signaling strategic support from investors with networking and optical expertise.
  • The company says it will begin initial chiplet shipments this year and projects revenues in the hundreds of millions by the end of 2027, a forecast that the company itself has reported and that depends on customer adoption.
  • Eliyan develops electro‑optical interconnects and modular chiplets for Die‑to‑Die, Chip‑to‑Chip and Rack‑to‑Rack connectivity, which aim to move data faster between processors, memory and networks so expensive AI accelerators are used more fully.
  • Investors and coverage note growing testing and interest from hyperscalers and infrastructure firms, but wider adoption will hinge on successful integration, manufacturing scale‑up and competition from established paths such as Nvidia’s networking moves and cloud deals with Broadcom and Marvell.