Overview
- Comfort Systems reported a 15.5% sequential backlog increase in Q3, with CEO Brian Lane noting no let‑up in project opportunities tied to data‑center work.
- Teradyne said its Semiconductor Test Group outperformed expectations in Q3 and guided a 25% sequential sales rise for Q4, driven by AI‑related SoC test demand.
- These early‑cycle indicators suggest AI infrastructure and chip‑test spending remains active as the new year begins.
- Analysts caution that strong spending trends can coexist with stretched valuations at select AI names without implying an immediate bubble burst.
- Commentary urges a focus on high‑quality, cash‑generating leaders to navigate potential overinvestment risks in the AI buildout.