Overview

• A REWA Technology teardown reports 14 internal screws, less adhesive, and an easier battery removal system than in recent models.
• Both rear and front camera modules use larger sensors, and the front array switches the positions of the dot projector and flood illuminator compared with iPhone 16 Pro.
• The logic board is smaller, denser, and mounted horizontally, which the teardown describes as likely improving drop protection while adding more connectors that demand care.
• Thermal management features include a large graphene heat-spreader, and one video suggests a new vapor chamber tied to a shield-mounted battery layout.
• The NAND chip partially overlaps the A19 on opposite sides of the board, raising risk for heat-based storage work, and newly introduced connectors could complicate certain repairs.