Overview
- D-Wave says it has demonstrated scalable control by integrating a high-coherence fluxonium qubit die with a multilayer control chip using superconducting bump bonds inside a cryogenic package.
- The approach multiplexes control signals to reduce the number of cables entering the cryostat, which the company says lowers thermal load and system complexity as processors grow.
- D-Wave worked with Minnesota-based SkyWater Technology to build the multichip package, leveraging multilayer fabrication techniques developed for its annealing systems.
- Executives describe the result as an early step toward error-correctable hardware, with a target to show a small surface-code logical qubit before the end of next year.
- Leadership cites roughly $830 million in cash and expressed customer interest to fund the gate-model program, while the company-reported claims await independent validation.