Overview

• The switch delivers 102.4 Tbps capacity with 200 Gbps per channel, doubling bandwidth versus Broadcom’s prior CPO generation.
• Broadcom claims about a 70% reduction in optical interconnect power versus pluggable optics by integrating TSMC COUPE photonic engines with advanced multi‑chip packaging.
• The design targets large AI clusters with improved link stability intended to reduce job interruptions and support deployments from 512 XPUs to 100,000+ in two‑tier networks.
• Early access customers are receiving samples of the TH6‑Davisson BCM78919 device, with stated interoperability for existing 400G and 800G ecosystems.
• Broadcom outlined a CPO roadmap to 400 Gbps per channel in the next generation, and shares rose about 2.4% after the announcement.